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What's the danger in...


estecoca

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Best results are found with lots of pressure on a flat surface. There is slight danger with the machine spinning the pad freely since the counterweight and your pressure isn't providing the necessary "umpf" to keep the pad from spinning. Fortunately the PC is also the tool that could remove any marring.

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moving the PC with the pad at an angle? I have read/heard to not do so and to keep the pad flat, but Im not sure what the danger is.

 

Sorry for the noob question. Thanks.

 

All questions are good ones my friend! A rotary buffer works on an angle, as a way to concentrate heat, to cut more.

 

A dual-action polisher only works when using it flat on a finish. Since the pad is oscillating, on an angle, it's actually digging into the clear. Not good.

 

Also, if you are using our Gen1 system, the plastic plate in the center of the pads will snap in no time!

 

Best results with the PC are achieved using it flat, while applying pressure when polishing/ correcting.

 

Hope this answers it, and always ask questions, regardless of how noob they may seem!:2thumbs:

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